The upcoming electronica show offers the next
opportunities to find out more about new processes and systems for laser micro machining
first hand.
You will find the range of LPKF systems for
electronics production and prototyping at Booth 419 in Hall A2.
Highlights are…
- The new
MicroLine 2000 P laser system, which was especially
designed for
cutting
of flex boards and cover layers.
- The systems for structuring of 3D molded interconnect
devices (MID) also
have an addition to the product
family. The new
LPKF Fusion 3D
1200 laser
direct structuring system has a highly dynamic rotary
indexing table that facilitates assembly and reduces non-productive
time.
- In the stencil
laser business LPKF is now expanding the working range.
With
little effort, the benchmark-setting StencilLaser G6080 can be
extended to enable cutting
of stencils with a length of 1600 mm (length of
stencil frames: 1800 mm). These stencils simplify the manufacturing of
LED lights, which can be used in place of conventional fluorescent
tubes.
The proven prototyping lines will be on display at
the booth with all top systems. The ProtoLaser U3 for circuit board
structuring and micro-processing of delicate substrates, the ProtoMat D104,
which combines mechanical, and laser processing, and the LDS prototyping line
will all show what they can do at Booth
419 in Hall A2 (Munich, November 11-14, 2014).
Our experts await your questions. Find out first hand
and arrange
an appointment today. You can also request a free admission ticket.
LPKF Laser & Electronics AG
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You can also contact your Distributor for Sweden, Denmark and Norway
SOLECTRO AB www.solectro.se
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